AOC, DAC, AEC, ACC, and structured fiber assemblies engineered for AI fabrics, dense racks, telecom transport, and enterprise infrastructure.
The cable layer decides reach, density, thermals, and power efficiency long before the rest of the rack shows signs of stress. This portfolio is designed to give you the right medium for each hop without forcing compromises across the rest of the network.
Each family is positioned around reach, power profile, media type, and deployment density so the page feels closer to an engineering selector than a product list.
Active Optical Cable
For longer in-row and row-to-row connectivity where lower cable weight and cleaner airflow matter as much as signal quality.
Direct Attach Copper
The lowest-latency and lowest-power option for short-reach top-of-rack, NIC-to-switch, and GPU cluster interconnects.
Active Electrical Cable
A strong middle ground when passive copper is not enough but you still want a copper-first operational profile.
Active Copper Cable
Optimized for short- to mid-range copper runs, using active equalization to sustain high-speed performance.
Instead of starting with connector names, start with the constraint that matters most in the rack. That usually gets you to the right cable family faster.
| Specification | AOC | DAC | AEC | ACC |
|---|---|---|---|---|
| Maximum data rate | 800 Gbps | 400 Gbps | 400 Gbps | 200 Gbps |
| Maximum reach | 100 m | 5 m | 7 m | 10 m |
| Latency profile | Low | Ultra-low | Low | Low |
| Power profile | Higher | Lowest | Moderate | Moderate |
| Typical use | Spine-leaf, row-to-row, DCI | ToR, GPU clusters, intra-rack | Dense racks, extended copper links | InfiniBand and mid-range copper runs |
Every cable family should survive signal, thermal, and interoperability scrutiny before it gets anywhere near a production rack. The validation story is part of the product, not an afterthought.
BER testing, eye diagram analysis, and jitter checks across each cable class.
Thermal cycling and operating range validation for hotter rack and enclosure conditions.
Cross-vendor switch, NIC, and optics validation to reduce surprises in mixed environments.
Connector cycles, bend radius, and pull-strength verification built around real handling conditions.
When port density climbs, clean structured fiber becomes non-negotiable. MPO/MTP assemblies support 40G, 100G, 200G, and 400G architectures with the consistency needed for high-count patching and predictable migration paths.
Accessory components are where a lot of stability is won or lost. This section keeps them visually aligned with the rest of the portfolio instead of treating them like leftovers.
Push-pull connectivity for single mode and multimode fiber assemblies.
Small-form-factor density for patch panels, cassettes, and high-port-count builds.
Multi-fiber adapter options that support structured trunk and cassette workflows.
Fixed and variable attenuation for controlling optical budgets and protecting receiver performance.
The use cases below stay concise, but the visual treatment follows the same system as your newer pages so the whole site reads as one product family.
High-density cabling for enterprise, hyperscale, and cloud fabrics.
Carrier-grade assemblies for transport, aggregation, and service-provider access layers.
Campus and office connectivity that stays manageable as traffic and port counts grow.
Fronthaul and backhaul builds that need stability, density, and straightforward serviceability.
Work with our connectivity team to narrow the right cable family for your rack layout, switching platform, and deployment profile before the wrong interconnect becomes a scaling problem.
